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NUP4103FC Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive portable equipment and other applications. Its integrated design provides very effective and reliable protection for four (4) separate lines using only one package. These devices are ideal for situations where board space is a premium.
Features
http://onsemi.com CIRCUIT DESCRIPTION
A1 C1
* * * * *
Unidirectional, Quad ESD Protection Ultra-small Flip-Chip Packaging (0.95 mm x 1.33 mm) Compliance with IEC61000-4-2 (Level 4) Requirements Maximum Leakage Current of 100 nA at 3.3 V Pb-Free Package is Available*
B2
Benefits
* Protects Four Data Lines from ESD while Reducing Component * Small Package Saves on PCB Real Estate * Provides Protection for ESD Industry Standards, IEC 61000, * Low Leakage Capability Minimizes Power Loss in the System
Applications
A3
C3
Count
HBM and MM
1
MARKING DIAGRAM
* * * *
ESD Protection for Portable Equipment Cell Phones MP3 Players PDAs
5-PIN FLIP-CHIP CSP PLASTIC CASE 766AB E M G
= Specific Device Code = Date Code = Pb-Free Package
(Note: Microdot may be in either location) TOP VIEW (Bumps Down) 123 A B C C C C BOTTOM VIEW (Bumps Up) 3 21 A B C
MAXIMUM RATINGS
Rating ESD Discharge IEC61000-4-2, - Air Discharge - Contact Discharge Human Body Model Machine Model Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Symbol VPP Value 30 30 16 1.6 150 -40 to +85 -55 to +150 Unit kV
TJ TA TSTG
ORDERING INFORMATION
Device NUP4103FCT1 NUP4103FCT1G Package Flip-Chip Flip-Chip (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
March, 2006 - Rev. 1
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Publication Order Number: NUP4103FC/D
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EMG G
NUP4103FC
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Parameter Reverse Stand-Off Voltage Breakdown Voltage Leakage Current Junction Capacitance Symbol VRWM VBR IR CJ Conditions IRWM = 10 mA (Note 1) IT = 1.0 mA (Note 2) VRM = 3.3 V per line VR = 2.5 V, f = 1 MHz 30 6.0 7.0 Min Typ Max 5.5 8.0 100 Unit V V nA pF
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM) which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT.
TYPICAL PERFORMANCE CURVES
(TJ = 25C unless otherwise specified) 50 45 IR, Leakage Current (A) C, Capacitance (pF) 10.0E-9 40 35 30 25 20 10.0E-12 -40 -15 100.0E-9
1.0E-9
100.0E-12
0
1
2 3 VR, Reverse Voltage (V)
4
5
35 10 T, Temperature (C)
60
85
Figure 1. Reverse Voltage vs Junction Capacitance
Figure 2. Reverse Leakage Current vs Junction Temperature
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NUP4103FC
2.0 V/div
200 ns
Figure 3. ESD Response for Human Body Model (+8 kV)
500 mV/div
200 ns
Figure 4. ESD Response for Human Body Model (-8 kV)
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NUP4103FC
Printed Circuit Board Recommendations
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 500 mm Pitch 300 mm Solder Ball 250 mm +25 / -0 Round NSMD 350 mm 25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 5. Solder Mask versus Non-Solder Mask Definition
Controlled Atmosphere 250 200 TEMPERATURE (C) 183 C 150 140 to 160 C 100 50 0 1 to 5 C/s 0 1 2 3 4 5 2 to 5 C/s 225C Min 235C Max
1 to 2 min 30-100 sec TIME (minutes)
Figure 6. Solder Reflow Profile
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NUP4103FC
PACKAGE DIMENSIONS
5-PIN FLIP-CHIP CSP CASE 766AB-01 ISSUE O
4X
D 0.10 C
A
B
E
TERMINAL A1 LOCATOR
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX 0.680 --- 0.210 0.270 0.380 0.430 1.330 BSC 0.960 BSC 0.290 0.340 0.500 BSC 0.433 BSC 0.866 BSC
0.10 C A2 0.05 C
SEATING PLANE
1 5X
b
2 3 A B C
0.05 C A B 0.03 C
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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A1 A C D1 f e
DIM A A1 A2 D E b e f D1
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NUP4013FC/D

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